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STEM Faculty

Meet the people who make up STEM Faculty.

Jan Kowal

Jan Kowal

Senior Lecturer

engineering-and-innovation

Professional biography

I came to the OU after 20 years working as an engineer in industry, most recently in the field of micro-electromechanical systems. This is a manufacturing technology that uses wafer-scale processing techniques to shape materials such as silicon and glass into miniature physically or chemically active components. This has largely involved designing sensors of various kinds (accelerometers, pressure sensors, CO2 sensors), as well as structures such as microfluidic devices and integrated optical chips. An important process within this technology is that of semiconductor wafer to wafer bonding, and since joining the OU I have been trying to understand the mechanisms by which exposing wafers to gas discharges enhances the strength of the bond made subsequently.

Research interests

More recently, I have been working on the measurement of residual stress. Here, we have been improving a relatively new method of mapping residual stresses, known as the contour method, in which the sample to be measured is first carefully cut in two using a wire electrodischarge machine. The deviations from flatness of the cut surfaces are then measured and these data are used in a finite element model to calculate the residual stresses that must have been present before the cut was made.

Teaching interests

I have completed a term of office as the Director of Teaching for the School of Engineering and Innovation (2014 - 2021).

I am a module team member on T176 and T276, and production chair of the replacement module for T176, T195 

I am a member of the Recruitment and Admissions Committee of the Engineering Professors' Council 

Latest publications

Displaying 10 of 14 publications

  • Ghosh, P., Ivaturi, A., Bhattacharya, D., Bowen, J., Nixon, T., Kowal, J., Braithwaite, N. S. J. and Krishnamurthy, S., 2020, ‘Efficient hole transport material formed by atmospheric pressure plasma functionalization of Spiro-OMeTAD’, Materials Today Chemistry, 17, https://oro.open.ac.uk/71409/.
  • Araujo de Oliveira, J., Kowal, J., Gungor, S. and Fitzpatrick, M. E., 2015, ‘Determination of normal and shear residual stresses from fracture surface mismatch’, Materials & Design, 83(C), pp. 176–184., https://oro.open.ac.uk/43524/.
  • Araujo de Oliveira, J., Fitzpatrick, M. E. and Kowal, J., 2014, ‘Residual stress measurements on a metal matrix composite using the contour method with brittle fracture’, in 9th European Conference on Residual Stresses, 7-10 Jul 2014, Troyes, France., https://oro.open.ac.uk/41389/.
  • Hosseinzadeh, F., Kowal, J. and Bouchard, P. J., 2014, ‘Towards good practice guidelines for the contour method of residual stress measurement’, The Journal of Engineering, 2014(8), pp. 453–468., https://oro.open.ac.uk/40791/.
  • Masteika, V., Kowal, J., Braithwaite, N. S. and Rogers, T., 2014, ‘A review of hydrophilic silicon wafer bonding’, ECS Journal of Solid State Science and Technology, 3(4), Q42-Q54., https://oro.open.ac.uk/40115/.
  • Naveed, N., Hosseinzadeh, F. and Kowal, J., 2013, ‘Residual stress measurement in a stainless steel clad ferritic plate using the contour method’, in ASME 2013 Pressure Vessels and Piping Conference, 14-18 Jul 2013., https://oro.open.ac.uk/40536/.
  • Masteika, V., Kowal, J., Braithwaite, N. S. and Rogers, T., 2013, ‘The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers’, Microsystem Technologies, 19(5), pp. 705–712., https://oro.open.ac.uk/35366/.
  • Endean, M., Goodyear, A., James, J., Kowal, J. and Williams, K., 2012, ‘The philosophy and pedagogy of practical work for engineering undergraduates and the potential for online practical activities to enhance their experience - An exploratory workshop’, in EE 2012 - International Conference on Innovation, Practice and Research in Engineering Education, Conference Proceedings, 18-20 Sep 2012, Coventry University., https://oro.open.ac.uk/40819/.
  • Braithwaite, N., Al-Kuzee, J., Lima, P., Kowal, J. and The Open University, 2009, ‘Surface activation and direct bonding of semiconductor wafers’, GB 2458256., https://oro.open.ac.uk/29456/.
  • Kowal, J., Nixon, T., Aitken, N. and Braithwaite, N. S. J., 2009, ‘Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge’, Sensors and Actuators A: Physical, 155(1), pp. 145–151., https://oro.open.ac.uk/18380/.